1、 Definition of eutectic and epoxy die bonders
Eutectic machine is a welding equipment used in the manufacturing of electronic components, which is used to weld eutectic points on electronic components. Eutectic point refers to two or more metal points on electronic components that mix and become eutectic alloys during melting. Eutectic points are an important part of circuits and connections in electronic components.
Solid crystal machine is also a welding equipment used in electronic component manufacturing, which is used to fix grains between chips and substrates. Solid crystal machines are mainly used for welding electronic components such as BGA, CSP, QFN, etc.
2、 The working principle of eutectic and epoxy die bonders
The working principle of an eutectic machine is to heat the metal at the eutectic point to a sufficiently high temperature to melt it into an eutectic alloy, and then let it cool and solidify to form a stable connection at the eutectic point. Eutectic machines typically use technologies such as infrared, laser, and hot air to heat metals.
The working principle of the epoxy die bonder is to place grains on the solder pads of the substrate and use thermal pressure to connect them with the substrate solder pads. Solid crystal machines typically use techniques such as thermal pressure and hot air to achieve welding.
3、 Application scenarios of eutectic and epoxy die bonders
The eutectic machine is mainly used for welding electronic components with eutectic points, such as DIP, SOP, QFP, PLCC and other packaging.
Solid crystal machines are mainly used for soldering electronic components such as BGA, CSP, QFN, especially for high-speed signals and high-density packaging.
4、 Advantages and disadvantages of eutectic and epoxy die bonders
The advantages of eutectic machines are simple process and low cost, making them the preferred equipment for mass production of eutectic points. The disadvantage is that the solder joints are not stable enough and are prone to quality problems such as virtual soldering.
The advantages of solid crystal machines are stable solder joints and good welding quality, making them particularly suitable for welding high-end electronic components. The disadvantage is that the cost is higher and the production efficiency is lower than that of eutectic machines.
【 Conclusion 】 Although both eutectic and epoxy die bonders are welding equipment used for electronic component manufacturing, there are still significant differences due to their different welding methods and application fields. The selection of appropriate equipment depends on the product’s requirements and performance requirements.
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