by HJSAUTO | May 28, 2024
AFM Atomic Force Microscope HJAFM-1100 HJAFM-1100 brings scanning accuracy at the angstrom level, while also providing measurements of phase, electric field, magnetic field, and conductivity. Provide fast and high-precision measurement data for the laboratory. Quick...
by HJSAUTO | May 28, 2024
Eutectic Die Bonder Eutectic Die Bonder HJC-560E Solution customized. A specialized production equipment that heats and bonds the heat sink (Submount) and chip (LD) onto the TO56 socket. Quick inquiry Machine Introduction: This device is a specialized production...
by HJSAUTO | May 28, 2024
Die Bonder Die Bonder HJC-560D Automatic die bonding machine, die attach equipment. Waffer automatic loading and unloading is optional. Quick inquiry Machine Features: Direct drive bonding head with 180 ° swing arm rotation. Multi ejector pin design for easy...
by HJSAUTO | May 22, 2024
Die Sorter Wafer to Tape and Reel Die Sorter HJC-560R Automatic wafer to tape and reel machine with mapping function. Rail track for carrier tape width can be adjusted. Quick inquiry Machine Features: Direct drive bonding head with 180 ° swing arm rotation. Multi...
by HJSAUTO | May 21, 2024
Die Sorter Wafer to Waffle Pack Die Sorter HJC-560T Automatic wafer to waffle pack die sorting machine with mapping. Waffer automatic loading and unloading is optional. 2×2 or 4×4 waffle pak automatic loading/unloading with magazine is optional. Machine...
