Die Bonder
Die Bonder HJC-560D
Automatic die bonding machine, die attach equipment. Waffer automatic loading and unloading is optional.
Machine Features:
- Direct drive bonding head with 180 ° swing arm rotation.
- Multi ejector pin design for easy adaptation to different types of die sizes.
- 1.3 million resolution visual system for positioning chips and frames.
- Vision live position, accurate picking even after chip moved on tape.
- 5. Manual loading and unloading with fixture.
- 6. The wafer ring fixture can be used for 12 inch, 8 inch, and 6 inch iron ring wafer.
- Accurate chip counting function.
- English/Chinese two version languages.
- Can be connected with MES. (Optional)
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Re:Die Bonder HJC-560D
SPECIFICATION
| Product application | MEMS， Storage, CIS, optoelectronics, etc | |
| Accuracy | ± 1.5um (standard patch) | |
| Equipment efficiency | 5S (standard patch, one pick&place); Excluding temperature curve | |
| Installation system | X/Y/Z | Travel: 350mmx500mmx50mm |
| Rotation axis | Travel: 360 °; Repetitive positioning accuracy: 0.02 ° | |
| Minimum suction size | 0.15*0.2mm | |
| Suction nozzle | Automatic nozzle replacement, one nozzle holder supports 13 nozzles | |
| pressure | 10-2000g (pressure real-time closed-loop feedback) | |
| Material system | Standard configuration | 2×2″/4×4″ gel pack/waffle pack |
| Standard configuration | 6 “/8” blue film system | |
| Preheating workbench | Temporary carrier board | Supports both soft and hard boards; Supports large-sized carrier boards |
| size | 300x300mm, customizable | |
| temperature range | 25-200℃ | |
| Flip system | Optional configuration | 180 ° flipping, customized for specific application nozzles |
| vision system | type | Two down view cameras and one high magnification up view camera |
| light source | Each camera is equipped with 4 programmable lights (collimated white light, circular RGB tricolor light) | |
| Factory requirements | source | 200-240VAC 50HZ single phase 20A |
| compressed air | 0.6Mpa 300L/min | |
| nitrogen | 0.3Mpa 30L/min 99.9% or higher | |
| vacuum | minus 80kpa 120L/min (Pipeline vacuum or vacuum pump) | |
| Weight | Around 2000kg |