Die Sorter
Wafer to Tape and Reel Die Sorter HJC-560R
Automatic wafer to tape and reel machine with mapping function. Rail track for carrier tape width can be adjusted.
Machine Features:
- Direct drive bonding head with 180 ° swing arm rotation.
- Multi ejector pin design for easy adaptation to different types of die sizes.
- 1.3 million resolution visual system for positioning chips and frames.
- Vision live position, accurate picking even after chip moved on tape.
- 5. Manual loading and unloading with fixture.
- 6. The wafer ring fixture can be used for 8 inch, and 6 inch iron ring wafer.
- Accurate chip counting function.
- English/Chinese two version languages.
- Carrie tape track width can be adjusted.
- Can be connected with MES. (Optional)
Discover the Power of High-Precision DIE SORTING MACHINE
Watch our video for detail. Machine solution can be customized based on product detail requirement.
| Content | Specification |
| UPH | ≥5k（related with wafer size/die size) |
| X、Y pick and place accuracy | ±25um |
| Angle accuracy | ±3° |
| Wafer ring size | 12inch、8inch、6inch、Automatic ring expanding mechanism |
| CCD max accuracy | 1um |
| Nozzle | 1PCS (nozzle pressure can be adjusted within 30g~300g) |
| Needle pin | 1PCS，multiple needle（optional） |
| Carrier tape width | Carrie tape complied with EIA481 standard. Track width is adjustable. |
| Load and unload | Manual loading/unloading (Automatic is optional) |
| Power input | AC 220V/50Hz |
| Power consumption | 800 W |
| Air input | 4~6 Bar |
| Machine size (W*D*H) | 1090*750*1600mm (with light) |
| Net weight | 1200 Kg |
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