HJS AUTOMATION INTERNATIONAL
Customized solution based on customer requirement: die sorter, die bonder, flip chip handling, eutectic die attach.
The core members have long served international large factories in Europe and America, with over 20 years of experience in high-precision chip packaging industry. We have a complete set of independent core technologies, including high-precision chip packaging technology, high-precision mechanical operation and control platform, machine vision and algorithms, and high-precision process modules.
Our 3um level high-precision die bonder machine has been commercialized on a large scale. The equipment has process capabilities such as
- COC/COS
- GOLD BOX
- AOC/COB
- TO
- RF/Hybrid Device
- Fan out
- Flip chip
It supports epoxy resin and other adhesive processes, eutectic processes, sintering processes, TCB hot pressing welding, ultrasonic welding, excitation welding and other technologies, and supports the packaging process requirements of third-generation semiconductor chips (gallium nitride GaN, silicon carbide SiC). It is suitable for optical communication, 5G RF, commercial lasers, high-power IGBT devices, storage, MiniLED, AR/VR, MEMS, LiDAR, military, aerospace, medical, etc. The key equipment for core chip packaging in the fields of health, advanced IC packaging, etc., has quickly gained high recognition from domestic industry customers due to its world-class product functions and quality.
We will be committed to building an international first-class high-end chip packaging equipment enterprise, leading the transformation and upgrading of China’s chip equipment manufacturing industry!