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die sorter HJC-560T

Die Sorter

Wafer to Waffle Pack Die Sorter HJC-560T

Automatic wafer to waffle pack die sorting machine with mapping. Waffer automatic loading and unloading is optional. 2×2 or 4×4 waffle pak automatic loading/unloading with magazine is optional.  Machine pick die from wafer and place to waffle pack, Gel-Pak, JEDEC tray or custom tray.

Quick inquiry

Machine Features:

  1. The servo direct-connected 180-degree pick-and-place head can be customized freely for 6-inch, 8-inch and 12-inch wafers, as well as sub-rings and iron rings;
  2. According to the wafer size (L,W,H), customized multi-thimble or single thimble mechanism;
  3. The wafer workbench can be equipped with an ion fan;
  4. Automatic search mechanism of wafer table, which automatically forms search track;
  5. Automatically searches for die according to the Mapping file.
  6. Special vacuum suction nozzle with large suction;
  7. Multi-sucker vacuum fixture with large suction;
  8. Using vacuum leak detection;
  9. Waffle placing inspection function;
  10. Identify defective chips such as missing corners and ink spots;
  11. Simple visual operation interface simplifies the operation;

High-Precision Wafer to waffle machine

Solution can be customized

Waffle tray or JEDEC tray

Can be flip chip

Loading/unloading can be automatic

Can have mapping function

 

 1. System functions 4. Die suction swing arm
Speed UPH:10K+/H (related to wafer size and blue film viscosity, subject to actual test results). Swing arm 180 rotatable
XY position accuracy ±25um Suction pressure Adjustable 30g—300g
Chip rotation ±3° 5. Wafer platform
2. Chip XY workbench Range of travel stroke Customized
Chip size 0.2mm×0.2mm-5mm×5mm (more size can be compatible by changing the lens barrel). XY resolution 0.02mil
Maximum chip ring size 6 “(other sizes can be customized). 6. Required facilities
Maximum chip area size 4″ Voltage/frequency 220V AC±5%/50HZ
Resolution ratio 0.04mil Compressed air 0.5MPa（MIN）
Z height stroke of thimble 4mm / Resolution: 0.04mil Rated power 800W
3. Image recognition system Gas consumption 5L/min
Gray scale 256 gray scale 7. Size and weight
resolution ratio 752×480 pixels (maximum 130W pixels) Long x wide x high 130×120×170cm
Accuracy of image recognition ±0.025mil@50mil observation range Weight 630kg

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